DuPont Microcircuit materials expands offerings for PE

DuPont MicrocircuitDuPont Microcircuit Materials (MCM) is expanding its portfolio of silver conductive inks formulated for use in printed electronics, to meet the need for low-cost processing in the high-growth and emerging markets for Touch Screens and devices such as Organic Light Emitting Diodes (OLEDs).

The new screen printable inks include: DuPont 7723, a low temperature firing silver ink suitable for printing on glass, and DuPont 9169, a low temperature curing Ag ink designed for flexible substrates.

“DuPont Microcircuit Materials has developed a broad range of conductive inks for printed electronic applications, and we continue to advance our technology offering by customizing materials for specific applications to meet our customers’ needs better and faster,” said Walt Cheng, global business director DuPont Microcircuit Materials. “We look at where the market is expanding, target key areas where more cost-effective solutions are needed and pursue those areas most aggressively. Touch Screen technology, OLED and thin film photovoltaics are all areas where we expect to grow by helping our customers succeed.”

According to industry estimates, the printed electronics market is expected to reach $10 billion by 2012, and as much as $300 billion by 2025. Estimates for growth in the global Touch Screen module market are similarly strong with a forecast to grow to $6.4 billion by 2013, and the market for OLED lighting and displays could reach more than $6.7 billion in 2014.

DuPont MCM continues to build its portfolio of products for these and other high-growth markets, with leading materials including DuPont™ Solamet® photovoltaic metallization inks for higher efficiency solar cells.

New DuPont 7723 delivers excellent adhesion to Indium Tin Oxide (ITO) coated glass, it is lead-free and solderable, ideal for use in Touch Screen devices.

DuPont 9169 has extremely high conductivity, strong adhesion to ITO coated flexible substrates, low contact resistance to ITO, and fine line capability. Both products are recommended where high performance on coated substrates is critical, such as in Touch Screens and OLEDs.

These are the latest in the broad and growing line of DuPont MCM functional inks used for forming conductive traces, capacitor and resistor elements, and dielectric and encapsulating layers that are compatible with many substrate surfaces including polyester, glass, and ceramic.

MCM ink technologies are suitable for screen print, flexo, gravure, photo-imaging, pad printing, and other processing techniques.

Ink jet materials are in development.

Printed electronic materials include biomedical sensor materials, flexible display materials, LuxPrint® electroluminescent materials, membrane touch switch materials, materials for printed batteries, printable materials for printed wiring boards, Radio Frequency Identification (RFID) antennae materials, Solamet® photovoltaic metallizations, touch sensor materials and other printed electronic applications.

DuPont Microcircuit Materials will feature these offerings in Stand 24 at the Printed Electronics Europe and Photovoltaics Europe combined 2010 Conference and Exhibition, which is taking place at the Maritim Hotel and Conference Center in Dresden, Germany, from April 13 – 14, 2010.

DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale and support of specialized thick film compositions for a wide variety of electronic applications in the display, photovoltaic, automotive, biomedical, industrial, military and telecommunications markets. For more information on DuPont Microcircuit Materials, visit http://mcm.dupont.com .

DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.

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